Test & Burn-In Sockets

Gold Technologies, Inc. (Goldtec) design and manufacture Test & Burn-in sockets

HIGH PERFORMANCE TEST SOCKETS

Applications

• Engineering test & Validation

• Product Characterization including RF

• System Level Test in PCB

• Volume Manufacturing with Test Handler

• Board to Board Interconnect

• Product Verification

• Chipset Testing & Recovery

• Failure Analysis

• Standard or Custom IC Package

• CSP, BGA, LGA, QFP, QFN/MLF, PGA, SOIC, SOJ, TSOP, TO, DIP, SIP, SOT

• -55°C to +155°C Testing

• 0.4mm to 1.27mm Device Pitch

• Standard or custom matched existing PCB Footprint

• 1 to 4 weeks lead time

• High Wattage or Heat Load – >80W dissipation

• Custom thermocouple fixture with heat sink, fan and RTD element

BURN-IN Test Sockets

Applications

• Burn-In

• BIST & DFT

• -55 °C to +155°C Testing

• 0.4mm to 1.27mm Device Pitch

• Standard PCB Footprint

• Standard or Custom IC Package

• CSP, BGA, LGA, QFP, QFN/MLF, PGA, SOIC, SOJ, TSOP, TO, DIP, SIP, SOT

• 4 to 6 weeks lead time

• Economical Socket for High volume testing

• Minimum to no tooling fee

Strip ContactorS

• Metal frame that functions as a stiffener and mount to PCB

• Universal footprint

• Replaceable cartridge